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Wafer plating equipment Product List

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Silicon wafer plating experiment equipment set

Silicon wafer plating experiment equipment set

It is a plating device for 2 to 12 inch silicon wafers.

It consists of a special tank and fixtures that take into account the current density distribution and the circulation of the plating solution. By using dedicated fixtures, precise plating for semiconductors and MEMS can be performed. Continuous filtration is carried out while creating gentle convection from the bottom of the tank, and it has an overflow structure, available in a single-side overflow type and a two-side overflow type that allows for high-speed stirring. Paddle stirring is used for direct agitation. With 20 years of experience as a plating device for wafers, we have obtained numerous patents. We also accommodate custom requests starting from a single fixture, so please feel free to contact us.

  • Other semiconductor manufacturing equipment
  • Plating Equipment
  • Wafer plating equipment

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No tooling required! "Wafer plating device"

No tooling required! "Wafer plating device"

A plating device that does not use jigs. It not only eliminates the complexity of installation and plating defects due to the deterioration of jig components, but also significantly improves the yield rate of good products!

The current wafer plating equipment is predominantly vertical, and the usability of the jigs attached to the plating devices is poor, leading to many issues such as the following: - Parts must be constantly replaced due to erosion from the plating solution. - Poor electrical conductivity results in defective plating. - The structure takes a long time to set the wafers, hindering smooth operations. - Difficult to transport, making efficient movement challenging. Furthermore, there is a demand for improved production efficiency due to the increasing need for high aspect ratio compatibility (supply of metal ions, uniform liquid flow) and enhanced uniform film thickness. Our "Wafer Plating Equipment" is jig-free, horizontal, and upward-facing, allowing us to resolve the issues present in conventional products. *For more details, please download the PDF or feel free to contact us.*

  • Plating Equipment
  • Surface treatment contract service
  • Wafer plating equipment

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